Replacing Thyristors in Siemens 6SY7010-0AB60 Rectifier Blocks

David Krause21 min read
SiemensTroubleshootingVFD / Drives
Licensed PE Working through this on a live machine? A Maine-licensed engineer can take it from here — included with IMD hardware, by the hour for everything else. Book an engineer

Replacing Thyristors in Siemens 6SY7010-0AB60 Rectifier Blocks

Overview

The Siemens 6SY7010-0AB60 and 6SY7010-0AB61 are designated thyristor power blocks used as the three-phase input rectifier section in SIMOVERT MASTERDRIVES (6SE70 series) AC drives. In the field case described, the host drive is a 6SE7041-8HK85-0AA0 (serial Q6N5164532003), a vector-controlled MASTERDRIVES unit. Two parallel/series rectifier blocks (type "A" 6SY7010-0AB60 and type "B" 6SY7010-0AB61) form a six-pulse or twelve-pulse input bridge, depending on the drive configuration. The discrete thyristor device fitted inside each block carries MLFB 6SY7010-0AA54.

When a thyristor fails inside one of these blocks, the field-replaceable item is the discrete semiconductor device, not the complete block assembly. The block itself is a mechanical structure consisting of two heatsink spreader plates, clamping hardware (bolts, pressure plates, and typically Belleville or spring washers), bus-bar terminations, and gate/cathode trigger lead connections. The block houses the discrete press-pack or stud-mount SCR and provides the clamping force that ensures low thermal resistance between the device pole faces and the heatsink.

The replacement task is fundamentally mechanical and thermal: de-mount the failed device, prepare the mating surfaces, apply fresh thermal interface material, mount the new device at the correct clamping force, and reconnect the electrical terminations. The critical parameter is the clamping torque, and the central challenge of this repair is that Siemens documentation does not publish the device-level mounting torque. The torque value is set by the original thyristor manufacturer (e.g. Semikron, Eupec/Infineon, IXYS, Westcode, Powerex), and the Siemens MLFB alone does not identify which manufacturer's device is fitted inside the block.

Critical: Do not guess the torque value. An under-torqued device exhibits high case-to-heatsink thermal resistance and will fail prematurely under load. An over-torqued device can crack the ceramic housing, causing immediate or latent failure. The torque must come from the original component manufacturer's datasheet.

Equipment Identification

Capture the full drive identification and the exact MLFB of the thyristor block before beginning any rebuild work. This information is required when contacting Siemens spare-parts service or third-party rebuild specialists.

Item MLFB / Serial Notes
Drive 6SE7041-8HK85-0AA0 SIMOVERT MASTERDRIVES, three-phase, vector-controlled rectifier/inverter
Drive serial Q6N5164532003 Required for spare-parts lookup
Thyristor block, type A 6SY7010-0AB60 One of two parallel/series paths in the rectifier
Thyristor block, type B 6SY7010-0AB61 Companion block, same mechanical outline
Discrete thyristor (SCR) 6SY7010-0AA54 Press-pack or stud-mount device inside the block

The Siemens MLFB is an internal ordering code. It does not identify the underlying thyristor chip manufacturer or the device type code that the manufacturer uses in its own catalog. The MLFB maps only to a Siemens spare-parts ordering number, which will deliver a replacement device of equivalent specification but typically without the original third-party manufacturer's type code stamped on it.

MLFB Hierarchy Decoded

The 6SY7010 series follows Siemens' standard MLFB (Machine-Lesbare Fabrikate-Bezeichnung) structure:

  • 6SY – Siemens power semiconductor / power block family designation
  • 7010 – Block series within the 6SY family
  • 0AA54 – The discrete thyristor (SCR) device that fits inside the block
  • 0AB60 / 0AB61 – Complete thyristor block assemblies (block, heatsink spreader plates, clamping hardware, bus bars) that accept the 0AA54 device

The block and the device are ordered separately. The block (0AB60 / 0AB61) is a mechanical assembly that clamps the device (0AA54) to a heatsink at a defined contact pressure. The torque applied to the block's clamping hardware translates directly into the contact pressure between the device pole faces and the heatsink/heat-spreader surfaces. This contact pressure determines both the thermal resistance (Rth(c-s)) and the electrical contact resistance of the cathode and anode interfaces.

Blocks 0AB60 and 0AB61 are mechanically similar but may differ in bus-bar orientation, gate-lead routing, or internal device polarity. Do not interchange them. Always replace like-for-like.

The Torque Identification Challenge

The mounting torque for the thyristor device is set by the device manufacturer, not by Siemens. It is determined by:

  1. Device diameter (larger diameter requires more clamping force to achieve a target contact pressure)
  2. Required contact pressure (kg-force or N per cm²) for thermal and electrical performance, typically specified by the device manufacturer
  3. Bolt size, grade, and thread pitch used in the block's clamping hardware
  4. Whether a spring or Belleville washer is included to maintain force over thermal cycling

Because Siemens MLFB 6SY7010-0AA54 does not identify the device manufacturer, the correct torque value cannot be selected from Siemens documentation alone. The technician must identify the original device manufacturer and type code by physical inspection, then obtain the manufacturer's datasheet to find the specified torque.

Identifying the Original Thyristor Manufacturer

Use the following procedure to determine the device manufacturer and type code of the failed thyristor:

  1. Remove the thyristor block from the drive per the drive's disassembly instructions.
  2. Extract the failed device from the block by removing the clamping hardware. The clamping arrangement is typically a pair of pressure plates and through-bolts, or a center-clamp arrangement with a single large bolt.
  3. Inspect the device housing for:
    • Manufacturer logo – Semikron (stylized "S" in a circle), Eupec (now Infineon), IXYS, Westcode, Powerex, or other
    • Manufacturer type code – Stamped or laser-etched on the ceramic housing, typically a part number such as SKN xx, T xxx, or similar
    • Lot / date code – Week and year of manufacture
    • Voltage class – Stated as repetitive peak off-state voltage (VDRM), commonly 1600 V, 1800 V, or 2200 V for industrial drives
    • Current rating – Average on-state current (IT(AV)), typically in the 100-400 A range for this block size
  4. Cross-reference the manufacturer type code in the manufacturer's datasheet catalog to obtain:
    • Mechanical outline and dimensions
    • Mounting torque or clamping force (stated in Nm for the clamping hardware)
    • Thermal resistance case-to-heatsink (Rth(c-s))
    • Recommended heatsink surface flatness and roughness
    • Required thermal interface material type and application thickness

If the original manufacturer code is illegible (common on devices that have been in service for 20+ years, or where thermal compound has contaminated the marking), measure the device's:

  • Outside diameter of the pole faces
  • Overall height (seated dimension)
  • Stud size and thread pitch (if stud-mount)
  • Center-to-center mounting hole spacing (if stud-mount)
  • Gate and cathode terminal orientation

These dimensions can be cross-referenced against standard outline codes (e.g. DO-200 series for stud-mount devices, or B-series / press-pack outlines for disc cells). The measured dimensions will narrow the candidate devices to a small set, and the manufacturer's catalog can then be searched for matching electrical ratings.

Disc versus Stud-Mount Device Recognition

Devices of this class are available in two outline families:

Feature Press-Pack / Disc Cell Stud-Mount
Mechanical outline Flat disc, two pole faces, no stud Cylindrical body with threaded stud on one pole face
Clamping method Clamped between two heatsink spreader plates via through-bolts or center-bolt Threaded into a tapped heatsink or clamped with a nut
Typical torque application Torque on clamping hardware (through-bolts) compresses the device between plates Torque on the stud nut (or into the tapped hole) sets contact pressure
Typical current range 200-3000+ A 10-500 A
Thermal performance Double-sided cooling, lower Rth Single-sided cooling, higher Rth

The 6SY7010-0AB60 block is most likely a press-pack / disc-type arrangement based on the MASTERDRIVES rectifier design convention, but physical inspection is required to confirm. The clamping hardware configuration will indicate which type is fitted.

Reference Procedure: ABB DCS 500B / DCS 600 Rebuild Methodology

For methodology reference on thyristor replacement in industrial DC drive converters, ABB publishes an installation and start-up manual for rebuild kits applicable to DCS 500B and DCS 600 converters. The document covers converter disassembly, thyristor module replacement, torque application, and recommissioning. While the Siemens 6SE70 / 6SY7010 product is a different family, the mechanical procedure (disc / press-pack device clamped between heatsink spreader plates) follows the same industry pattern. The ABB manual provides a useful procedural reference for technicians familiar with that platform.

The ABB DCS 500B / DCS 600 Rebuild Kit Installation and Start-Up Manual (document 3ADW000092R) is available from the ABB document library.

Required Tools, Materials, and Test Equipment

Item Specification
Calibrated torque wrench Range covering the device's specified torque; for press-pack devices of this class, typically 20-100 Nm. Use a wrench with ±4% accuracy or better.
Thermal interface compound Silicone-based or equivalent, rated for the device's maximum junction temperature. Follow device manufacturer recommendation on type (e.g. Dow Corning 340, Electrolube HTS).
Heatsink surface preparation Clean lint-free cloth, isopropyl alcohol (≥99%), non-abrasive cleaner. Do not use solvents that leave residue.
Surface flatness gauge For verifying heatsink surface flatness meets device datasheet specification (typically ≤0.02 mm over the contact area).
Lifting fixture For handling the block safely when the device is heavy. The block may weigh 5-15 kg depending on size.
ESD protection Wrist strap, grounded workbench, ESD-safe mat. Gate-trigger electronics are sensitive to static discharge.
Digital multimeter For continuity and resistance checks on gate-cathode circuit and power terminations.
Insulation resistance tester (megger) 500 V DC or 1000 V DC test voltage, depending on drive voltage class. For pre-energization testing.
Clamp-on ammeter For verifying current balance between the three rectifier phases during commissioning.
Infrared thermometer or thermal camera For verifying heatsink temperature balance under load during commissioning.

Safety Precautions and Lockout/Tagout

Working on the rectifier section of an energized or recently-energized drive is hazardous. The DC bus capacitors in the MASTERDRIVES 6SE70 retain dangerous voltages for several minutes after mains isolation. The following safety procedure is mandatory before any work on the thyristor block:

  1. Open the drive's main disconnect and lock it in the open position (LOTO).
  2. Wait for the DC bus capacitors to discharge per the drive's safety instructions. For the 6SE70 series, the minimum waiting time is 5 minutes after mains isolation; some configurations require longer.
  3. Verify DC bus voltage with a voltmeter at the drive's DC bus test points. The reading must be below 50 V DC before proceeding. If the reading is higher, the discharge circuit is faulty – do not proceed.
  4. Verify absence of mains voltage at the input terminals with an appropriately rated voltage tester.
  5. Ground the DC bus with a portable grounding set if the drive is to be left unattended during the work.
  6. Wear appropriate PPE: insulated gloves rated for the drive's voltage class, safety glasses, and arc-flash protective clothing if the drive is rated above 50 V or 50 A fault capacity.
Warning: The thyristor gate-cathode circuit is low-impedance and can be damaged by ESD. Observe ESD precautions when handling gate leads and trigger boards. Do not touch gate terminals while the drive is energized – the gate trigger pulses are at logic levels but are referenced to the cathode, which may be at line potential.

Disassembly Procedure

  1. Remove the rectifier compartment covers per the drive's service manual. The 6SE70 series uses a modular compartment layout; the rectifier section is typically in the upper or front section of the drive.
  2. Document all electrical connections to the thyristor block with photographs before disconnection. Pay particular attention to gate-lead polarity (color coding or marker) and bus-bar orientation.
  3. Disconnect the gate and cathode trigger leads. Note the connector type and orientation. Do not pull on the wires – use the connector's release mechanism.
  4. Disconnect the power bus bars to the block. These are typically bolted connections; note the bolt size, grade, and torque specification for reassembly.
  5. Unbolt the block from its mounting position and remove to a clean, ESD-safe workbench.
  6. Disassemble the block's clamping hardware in the reverse order of assembly. Note the position and orientation of any spring washers, Belleville washers, or pressure plates – these determine the clamping force distribution and must be reinstalled in the same configuration.
  7. Extract the failed thyristor device. Inspect the pole faces for pitting, arcing damage, or thermal compound contamination. The failure mode visible on the failed device (short, open, or mechanically cracked) is useful diagnostic information.
Do not reuse the old thermal interface compound. Remove all residue from the heatsink spreader plates and the new device's pole faces using isopropyl alcohol before applying fresh compound. Old compound is contaminated with thermal cycling byproducts and will not provide reliable thermal contact.

Heatsink Surface Preparation

The heatsink spreader plate surfaces that contact the thyristor pole faces must meet the device manufacturer's flatness and roughness specification. Typical requirements:

  • Flatness: ≤0.02 mm over the contact area (for press-pack devices in this class)
  • Roughness: Ra ≤0.8 µm
  • Cleanliness: Free of thermal compound residue, oxidation, scratches, and dents

Inspect the spreader plate surfaces under good lighting. If flatness is in question, use a surface plate and feeler gauges or a dial indicator to measure. If the surface is scratched or pitted beyond the device manufacturer's specification, the spreader plate must be refaced (machined) or replaced. A warped or damaged spreader plate will cause uneven contact pressure and device failure.

Thermal Interface Material Selection

The thermal interface material (TIM) fills the microscopic air gaps between the device pole face and the heatsink spreader plate, reducing thermal resistance. For press-pack thyristors in industrial drives, the TIM is typically a silicone-based thermal compound applied as a thin film. Key considerations:

  • Thermal conductivity: Typically 0.5-1.0 W/m·K for silicone compounds. Higher-conductivity compounds are available but may contain metallic particles that are not suitable for electrical insulation.
  • Operating temperature range: Must cover the device's maximum junction temperature, typically -40 °C to +200 °C.
  • Application thickness: Typically 50-100 µm wet film. Follow device manufacturer recommendation.
  • Compatibility: Must be compatible with the device's pole-face plating (typically silver or nickel).

Apply the compound with a clean spatula or roller in a thin, uniform layer. Avoid air bubbles. Some manufacturers specify a screening or stamping method for consistent thickness.

Mounting the Replacement Thyristor

  1. Verify the replacement device's type code, voltage class, and current rating match the original. Do not substitute a lower-voltage or lower-current device. A higher-rated device is acceptable; a lower-rated device is not.
  2. Inspect the new device's pole faces for any surface damage, oxidation, or contamination. The pole faces must be clean, flat, and free of scratches. Handle the device by its housing or mounting hardware – do not touch the pole faces with bare fingers (skin oils cause corrosion).
  3. Apply a thin, uniform layer of thermal interface compound to both pole faces. The compound must be free of air bubbles.
  4. Place the device between the heatsink spreader plates, observing the correct polarity (anode/cathode orientation per the block's marking and the original wiring). The gate and cathode terminals must face the correct direction for the trigger leads to reach without strain.
  5. Reassemble the clamping hardware. Ensure any spring / Belleville washers are oriented to provide the correct force distribution. The washers should be installed in the same configuration as originally fitted.
  6. Tighten the clamping bolts in a star / cross pattern to distribute the load evenly. This is critical – uneven torque will cause the device to contact the spreader plate on one side only, leading to high local thermal resistance and failure.
  7. Apply the final torque per the device manufacturer's datasheet. Use a calibrated torque wrench. The typical tightening sequence is to bring all bolts to 50% of final torque in star pattern, then to 75%, then to 100%, allowing the device to settle between each pass.

Torque Application Methodology

The mounting torque is specified by the device manufacturer for a reason: it produces a specific contact pressure between the pole face and the spreader plate, which in turn produces a specific thermal resistance and electrical contact resistance. Deviating from the specified torque by more than ±10% can push the thermal resistance outside the device's design limits.

The recommended tightening procedure for multi-bolt clamps:

  1. Hand-tighten all bolts until the clamping hardware is snug against the device.
  2. Tighten each bolt to 30% of final torque in a star pattern (opposite bolts first).
  3. Tighten each bolt to 60% of final torque in a star pattern.
  4. Tighten each bolt to 100% of final torque in a star pattern.
  5. After a 5-minute settling period, re-check torque on each bolt and re-tighten to 100% if any have relaxed. This accounts for thermal compound squeeze-out and surface micro-deformation.

For single center-bolt clamps, the procedure is similar but applied to the single bolt. Use a torque wrench with a long handle to ensure smooth, controlled torque application.

Clamping Force versus Torque: The Physics

The relationship between applied torque and resulting clamping force is:

F = T / (k × d)

where:

  • F = clamping force (N)
  • T = applied torque (N·m)
  • k = nut factor (typically 0.15-0.25 for steel-on-steel, lubricated)
  • d = nominal bolt diameter (m)

The nut factor k depends on bolt finish, lubrication, and thread pitch. The device manufacturer specifies the torque required to achieve a target clamping force, assuming a particular nut factor. If the bolt is replaced with a different grade or finish, or if a different lubricant is used, the actual clamping force at the specified torque will differ from the design intent.

For a typical press-pack thyristor in the 200-400 A class, the required contact pressure is in the range of 1-3 kN per pole face, distributed evenly across the contact area. The bolt size in the block's clamping hardware is selected to achieve this force at the specified torque.

If the original clamping hardware is reused, ensure the bolt threads are clean and lightly lubricated with a thread lubricant compatible with the bolt's grade. Do not use thread-locking compound on clamping bolts unless specified by the device manufacturer – thread-locking compound changes the nut factor and invalidates the torque specification.

Reassembly and Electrical Reconnection

  1. Reinstall the block into the drive, torquing the mounting bolts per the drive's service manual. For the 6SE70 series, the block mounting bolts are typically M8 or M10, torqued to 20-40 Nm depending on configuration.
  2. Reconnect the power bus bars. Torque the bus bar bolts per the drive's specification. For typical 6SE70 bus bar connections, torque values are in the 15-30 Nm range for M8 bolts and 30-50 Nm for M10 bolts, depending on bolt grade and joint configuration.
  3. Reconnect the gate and cathode trigger leads, observing correct polarity. The gate lead is typically the smaller-gauge wire; the cathode lead is the larger-gauge wire that also carries the load current. Refer to the photographs taken during disassembly.
  4. Inspect all connections for proper seating and torque. A loose bus bar connection will cause localized heating and voltage drop; a loose gate lead will cause intermittent triggering.

Pre-Energization Testing

Before applying power to the drive, perform the following tests:

  1. Gate-cathode continuity check: Measure resistance between gate and cathode with a digital multimeter. A healthy SCR typically shows 10-100 Ω in the gate-cathode junction. A reading of 0 Ω (short) or infinity (open) indicates a damaged device. Note that an SCR cannot be tested with a simple diode-test mode on a multimeter – the gate trigger is required to latch the device.
  2. Insulation resistance test (megger): Apply 500 V DC (or 1000 V DC, per the drive's voltage class) between each power terminal and ground. Minimum acceptable insulation resistance is typically 1 MΩ for industrial drives. A lower reading indicates moisture ingress, contamination, or a damaged device.
  3. Phase balance check: With the drive in a no-load state, measure the DC bus voltage. It should be within 1-2% of the expected value. An imbalance indicates a poor connection or a damaged device.
  4. Visual inspection: Verify all covers are reinstalled, all fasteners are torqued, and no tools or debris are left in the drive enclosure.

Commissioning and Load Verification

  1. Power up the drive's control section only (per drive commissioning procedure) and verify no fault codes are present. The 6SE70 series displays fault codes on the PMU (Parameterization Unit) or via DriveMonitor / STARTER commissioning software.
  2. Run the drive's rectifier self-test or commissioning routine if available. The 6SE70 has a built-in commissioning routine that exercises the rectifier section.
  3. Apply a small load (10-20% of rated) and monitor the rectifier output voltage and current for balance between the three phases. An imbalance greater than 5% indicates a poor connection or a damaged device.
  4. Check the heatsink temperature of the rebuilt block under load using an infrared thermometer or thermal camera. It should match the other blocks within 5-10 °C. A higher temperature indicates high thermal resistance (under-torque, insufficient thermal compound, or damaged pole face).
  5. Gradually increase the load to 50%, 75%, and 100% of rated, monitoring temperatures and current balance at each step. Allow at least 15 minutes at each step for thermal stabilization.
  6. Run the drive at full load for a thermal soak period of 1-2 hours. Monitor the rectifier temperatures throughout. Temperatures should stabilize and remain within the device's rated maximum case temperature (typically 125-140 °C for industrial SCRs).
  7. Document the commissioning results – voltage balance, current balance, temperature readings, and any fault codes encountered. This baseline is useful for future maintenance comparisons.

Common Failure Modes and Troubleshooting Matrix

Observed Symptom Likely Cause Corrective Action
Thyristor short-circuited (anode-cathode short) Overvoltage transient, thermal runaway, or manufacturing defect Replace device; investigate surge protection (MOV, snubber circuits) and verify gate trigger is not stuck on
Thyristor open-circuited (anode-cathode open) Gate trigger failure, loss of gate-cathode connection, or thermal/mechanical fracture Replace device; verify gate trigger circuit operation and gate lead connection
Device physically cracked Over-torque during installation, mechanical impact, or thermal shock Replace device; review torque procedure and verify clamping hardware condition
Heatsink temperature high on rebuilt block only Under-torque, insufficient thermal compound, contaminated pole face, or damaged spreader plate Re-torque to specification, re-apply thermal compound, inspect spreader plate flatness
Heatsink temperature high on all blocks Cooling fan failure, blocked air filter, or ambient temperature too high Verify cooling system operation, clean air filter, check ambient temperature
Current imbalance between phases Poor bus bar connection, damaged device, or gate trigger issue Re-torque bus bar connections, test device, verify gate trigger signals
Drive reports rectifier overcurrent fault (F029 or similar) Short-circuited device, insulation breakdown, or load fault Test device with megohmmeter, inspect insulation, check motor and cabling
Drive reports rectifier overvoltage fault Mains overvoltage, regenerative load, or snubber failure Check mains voltage, verify snubber circuits, check deceleration ramp settings
Intermittent triggering (device fires erratically) Loose gate lead, damaged gate trigger circuit, or noisy gate signal Re-seat gate connector, verify gate trigger circuit, check for electrical noise sources

Preventive Maintenance Recommendations

To extend the service life of the thyristor blocks in the 6SE70 rectifier section:

  • Annual thermal inspection: Use an infrared thermometer or thermal camera to scan all rectifier blocks under full load. Compare to baseline. A rising temperature trend indicates degrading thermal interface or device wear.
  • Annual visual inspection: Check for dust accumulation on heatsinks, loose bus bar connections, and signs of overheating (discoloration, melted insulation).
  • Quarterly air filter maintenance: Clean or replace the drive's air intake filters. Blocked filters reduce cooling airflow and increase device temperatures.
  • Annual connection torque check: Re-torque bus bar and block mounting bolts to specification. Thermal cycling can cause bolted joints to loosen over time.
  • Five-year overhaul: For drives in continuous service, consider a planned replacement of the thermal interface compound in the thyristor blocks at 5-7 year intervals. The compound degrades over time due to thermal cycling and pump-out effects.
  • Surge protection verification: Test the MOVs and snubber circuits in the rectifier section annually. Failed surge protection devices are a common cause of thyristor failure.

FAQ

What is the mounting torque for the thyristor in the 6SY7010-0AB60 block?

The torque is specified by the thyristor device manufacturer (e.g. Semikron, Eupec/Infineon, IXYS, Westcode), not by Siemens. The Siemens MLFB 6SY7010-0AA54 does not identify the device manufacturer, so the correct torque must be obtained from the original device's datasheet after physical identification of the device.

Can I reuse the old thermal interface compound?

No. Old thermal compound must be completely removed and fresh compound applied to both pole faces of the new device. Reusing old compound leads to high thermal resistance and premature device failure due to thermal cycling degradation and pump-out.

What drive uses the 6SY7010-0AB60 and 6SY7010-0AB61 blocks?

These blocks are used in the Siemens SIMOVERT MASTERDRIVES 6SE70 series. The specific drive in this case is the 6SE7041-8HK85-0AA0, a three-phase vector-controlled MASTERDRIVES rectifier/inverter unit.

Is there a Siemens manual that gives the thyristor replacement torque?

No. Siemens documentation references the block-level assembly procedure but does not publish the device-level torque. The torque must be obtained from the original thyristor manufacturer's datasheet after identifying the device manufacturer and type code from the physical device.

What is the ABB DCS 500B/600 manual used for in this context?

The ABB manual (3ADW000092R) provides a reference methodology for thyristor replacement in industrial DC drive converters. While the Siemens 6SE70 is a different product family, the mechanical procedure (disc/press-pack device clamped between heatsink spreader plates) follows the same industry pattern, and the manual serves as a useful procedural reference.

How do I identify the original thyristor manufacturer when the marking is illegible?

Measure the device's pole-face diameter, overall height, stud size and pitch (if stud-mount), and gate/cathode terminal orientation. Cross-reference these dimensions against standard outline codes (e.g. DO-200 series) and the candidate manufacturers' catalogs to identify the device. Electrical rating and voltage class can be measured or estimated from the drive's specifications.

What is the difference between a press-pack and a stud-mount thyristor?

A press-pack (disc) device is clamped between two heatsink spreader plates via through-bolts or a center-bolt, with both pole faces cooled. A stud-mount device is threaded into a tapped heatsink or clamped with a nut, with only one pole face cooled. Press-pack devices generally have lower thermal resistance and higher current ratings.

Back to blog